Tektronix unlocked the dynamic test system for SiC power devices, and the first one in South China was officially delivered in Shenzhen Mipson Semiconductor

A few days ago, Tektronix’s first DPT1000A in South China was officially delivered at Shenzhen Mipson semiconductor. The DPT1000A power device dynamic parameter test system was developed by Tektronix, and once it was launched, it received strong attention from scientific research and enterprise users.

A few days ago, Tektronix’s first DPT1000A in South China was officially delivered at Shenzhen Mipson Semiconductor. The DPT1000A power device dynamic parameter test system was developed by Tektronix, and once it was launched, it received strong attention from scientific research and enterprise users.

Tektronix unlocked the dynamic test system for SiC power devices, and the first one in South China was officially delivered in Shenzhen Mipson Semiconductor

The DPT1000A power device dynamic parameter test system is specially used for the dynamic characteristic analysis and testing of three-generation semiconductor power devices. It aims to solve the common difficult problems of customers in the dynamic characteristic characterization of power devices, including how to design high-speed driving circuits, optimize system parasitic parameters, How to adapt to a variety of chip packaging forms, how to select and connect probes for signal testing, and how to optimize and suppress noise and interference during testing. It helps customers to quickly evaluate devices in the stages of R&D design, failure analysis, factory inspection, and trial production, so as to respond to market demands and improve product performance faster.

Tektronix unlocked the dynamic test system for SiC power devices, and the first one in South China was officially delivered in Shenzhen Mipson Semiconductor

Mapleson Semiconductor is committed to the research and development and production of POWER MOSFET and silicon carbide products, and is one of the world’s top manufacturers of silicon carbide MOSFETs. In order to solve the testing problem of self-developed SiC power devices, Mipusen Semiconductor invested heavily to establish a professional power device testing laboratory. The power device dynamic parameter test system DPT1000A can effectively solve the characteristic characterization problem of high-speed SiC devices in the dynamic switching process, improve the test efficiency, and realize the automatic test of dozens of dynamic parameters. As the world’s leading manufacturer of SiC MOSFETs, MPS is also committed to promoting the research and development and popularization of third-generation semiconductor power devices, opening its internal testing laboratory to the outside world, providing a testing environment for power device customers across the country, and helping users across the country grow together. .

Tektronix unlocked the dynamic test system for SiC power devices, and the first one in South China was officially delivered in Shenzhen Mipson Semiconductor

DPT1000A system consists of power device double-pulse test driver board, high-voltage shield, chip temperature control system, Tektronix high-resolution oscilloscope, optical isolation probe, double-pulse signal source, high-voltage power supply and automated test software. Delivered to customers in a turnkey form, the test equipment and test items can be configured through the host computer software, test results can be obtained and data reports can be generated. The system has extremely high test flexibility, and can customize the drive circuit board design according to the requirements, and change the key device parameters such as gate resistance and load inductance. Under the premise of ensuring safety, comprehensive and accurate test and evaluation of the dynamic parameters of power devices is carried out. At the same time, the new five-series high-resolution oscilloscope and optical isolation probe specially used for high-voltage differential signal testing are used, which brings higher bandwidth and higher test accuracy to the dynamic characteristic characterization of three generations of semiconductor devices. Tektronix’s new five-series oscilloscope can support up to 8 channels of simultaneous measurement. For the half-bridge structure double-pulse test circuit, it can simultaneously test the upper and lower tube signals.

In addition, the system includes Tektronix’ unique optically isolated probe, TIVP, which provides an extremely high common-mode rejection ratio for more accurate waveform data during top-tube testing. Due to the extremely high floating voltage of the upper tube in the working state, the electrical signal measurement related to the upper tube is usually very difficult in traditional testing. Especially the gate voltage signal with low amplitude, or the working current of the upper tube read by the current sensor, is often superimposed on the high-voltage signal of hundreds of volts to thousands of volts. The high-voltage differential probe cannot accurately measure such signals. . The TIVP optical isolation probe completely solves this problem. While providing a test bandwidth of up to 1GHz, it maintains a common mode rejection ratio of 80dB to 120dB, and for the first time truly restores the electrical signal waveform related to the upper tube.

For the test of high-speed current in the system, a high-precision current sensor is used to obtain a higher current test bandwidth and a more accurate current waveform. At the same time, the system also provides the dynamic on-resistance test function, which can evaluate the dynamic on-resistance of the device in the high-speed switching state, helping customers to understand the dynamic characteristics of the device more accurately.

Ensuring the safety of instruments and equipment during the test is also an important factor to consider in the design process of DPT1000A. The driver board and the oscilloscope probe are independently installed in an independent safety shield, which is physically isolated to ensure that occasional faults under high-voltage and high-current working conditions will not cause damage to the oscilloscope, signal source, host computer and other equipment. In addition, due to the design of the vertical installation of the driver board daughter board and the motherboard, the power devices and oscilloscope probes can be distributed on both sides of the vertically arranged driver board daughter board. Even if the power device explodes during the test, the probe and other equipment will not be damaged, ensuring that the customer’s property loss is minimized.

The drive circuit development, hardware integration and test software research and development of the DPT1000A test system are all completed in China. Customers can put forward customized requirements for the system on the current basis to meet more types of power device testing requirements. At the same time, Tektronix also provides customers with localized technical support and services to ensure the smooth completion of your tests with the fastest response speed.

The Links:   LJ512U32 MDS200-16

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