In terms of advanced semiconductor technology, TSMC has become a leader, and others can’t see the taillights. This year’s mass production of 5nm, next year will be the turn of 3nm.

At yesterday’s meeting, TSMC announced the latest progress in advanced technology. The 5nm process has been mass-produced, with a good yield rate, while improving the efficiency and performance of the EUV process.

The 5nm process has two customers this year, Huawei Kirin 9000 and Apple A14, and will increase in the future. It is expected to contribute 8% of revenue this year, and it will increase by more than double digits next year.

After 5nm, there will be a 4nm process, but 4nm is just an improved version of the 5nm process, which is fully compatible and further improves performance, energy efficiency and density.

After that is the 3nm node, which will be another long-standing high-performance node for TSMC.

Compared with the 5nm process, the 3nm transistor density is increased by 70%, the performance is increased by 15% or the power consumption is reduced by 30%. At the same time, the FinFET process continues to be used, and the technology is more mature.

As for the production time of 3nm, TSMC said that it will start mass production in 2021 and finally achieve mass production in the second half of 2022.

Judging from TSMC’s statement, the 3nm node is progressing smoothly, and the mass production time is earlier than previous rumors.